SEMI predicts that global investment in 300mm wafer fab equipment will reach $374 billion between 2026 and 2028. Investments in 2025 are expected to increase 7% year-on-year to $107 billion, surpassing $100 billion for the first time, and continue to grow thereafter. Factors contributing to this growth include the decentralization of factory locations and growing demand for AI chips for data centers and edge devices. By sector, logic & microprocessors and memory-related technologies are the main drivers. By region, China leads the way, followed by South Korea, Taiwan, and the Americas.